The event will encompass the entire data center value chain, spanning from facility design and IT infrastructure to business implications. It will particularly highlight emerging markets and high-growth sectors.
Vertiv has announced its role as a Gold Sponsor for the inaugural edition of Data Centre Nation (DCN) Dubai 2024, set to take place on May 14 at Madinat Jumeirah. This event marks a pivotal moment for the data centre industry in the UAE and the wider Gulf region, providing a platform tailored to the rapidly evolving and expansive markets.
At the forefront of this event is Vertiv, showcasing its cutting-edge cooling technologies designed to address the pressing needs of modern data centres, particularly in managing the heat generated by AI and HPC (high-performance computing) applications. Vertiv’s participation underscores its deep commitment to the region, with a distinguished presence of key regional customers, consultants, and partners expected to attend.
Tassos Peppas, Regional Director for Middle East, Turkey and Africa (METCA) at Vertiv, said: “Vertiv has a successful history with Data Center Nation events in other countries, so we were pleased to sponsor the inaugural Data Center Nation event in Dubai. This is a great opportunity to network with our customers and showcase our latest power and cooling innovations to support AI.
“Vertiv is a leader in the AI market in the Middle East, with a number of AI projects already under our belt. Our AI-ready critical digital infrastructure is designed to support AI needs from edge and enterprise, commercial and industrial segments, to hyperscalers and colos.”
Vertivs Nigel Gore, Senior Director, Global High Density & Liquid Cooling, will be speaking at the event, with his presentation Emerging Technologies Impacting the Middle East Data Center Landscape. He will be touching on AI-ready cooling solutions. One technology, direct-to-chip liquid cooling where Vertiv Liebert XDU Coolant Distribution Unit is the crucial component of the cooling system, is an efficient system specifically designed to manage the substantial heat produced by AI and HPC components such as central processing units (CPU) and graphics processing units (GPU). This method is proficient in dissipating up to 75% of the heat generated by the equipment.
The second technology, rear-door heat exchangers, Vertiv Liebert DCD, is available in either passive or active cooling models, replacing traditional IT rack rear doors with a system that effectively dissipates heat from the rack equipment. This solution is often adopted in existing data centres, as the door is compact and easily installed, causing minimal disruption to data centre operations.
The solutions are engineered to handle higher-density workloads and challenging deployments, and operate with high energy efficiency and reliability.
Nigel Gore, Senior Director, Global High Density & Liquid Cooling, Vertiv, said: ‘In a landscape where the boundaries of digital infrastructure are constantly expanding, our pioneering cooling solutions stand at the forefront of industry evolution. They mark a proactive stride towards mastering the thermal challenges posed by AI and accelerated computing, underpinning our unwavering commitment to advancing data centre efficiency and performance.'”
Comprehensive technological expertise, ongoing research and development, global manufacturing capabilities, and an expansive services organisation support Vertivs robust array of offerings. Vertiv also partners in design and development with industry leaders, including NVIDIA and Intel, leveraging combined expertise to solve AI infrastructure support challenges. This combination uniquely positions Vertiv to meet the complex power and cooling needs of AI workloads effectively. As digital transformation continues to drive the evolution of technological infrastructure, Vertiv’s AI-ready solutions stand ready to support and enhance high-performance computing deployments across the globe.
Stand 7
